It is well known that the largest thermal gradient in military chassis is located between the card and the frame. For reference, in the typical military chassis, seen below, there are 3 primary thermal resistances:
Posted on May 14, 2018
Posted on May 09, 2018
Been poking around Advanced Cooling Technologies website, looking at the cool stuff (pun intended), but not sure what the next step is?
Posted on March 29, 2018
Today’s design engineers often wear many hats, acting as much a project manager as they do a design engineer.
Posted on March 21, 2018
Posted on February 19, 2018
Not too long ago, CPU’s functioned without advanced heat pipe heat sinks and liquid cooling. At the start of the computer revolution, it was not uncommon for CPU’s to use no heat sinks, followed by simple natural convection heat sinks for thermal enhancement.
Posted on February 06, 2018
The legend of Icarus’ daring escape from his imprisonment in Crete and his subsequent drowning in the Icarian Sea has inspired countless debates on what went wrong on that tragic day more than two thousand years ago.
Posted on January 23, 2018
As we roll towards the end of January, many of us are struggling to keep our new year’s resolution to lose weight. However, for the design engineer faced with packaging devices with increased power and decreased footprint, heat pipe based thermal solutions offer a great way to reduce heat sink size and weight, without deteriorating performance.
Posted on January 08, 2018
Recently, a study found that 1 in 5 electronics engineers identify thermal issues as a common cause of project delays. As we welcome 2018 with open arms, ACT's New Year's resolution is to ensure none of our engineer friends start their year off on the wrong foot by running into thermal troubles.