Is anyone sure of the answer? And what does this have to do with heat pipe reliability? In the world of heat pipes, we often have to answer a similar question… do you have heritage?
Posted on July 12, 2018
Posted on July 09, 2018
Gamers out there have been buzzing over the new 2018 Razer Blade laptop. We at ACT have been buzzing over the awesome shout outs to thermal management the laptop has been receiving in the mainstream media!
Posted on June 04, 2018
The team at Advanced Cooling Technologies (ACT) is celebrating the significant milestone of 25 Million Hours of flawless flights for our Constant Conductance Heat Pipes (CCHPs). ACT’s CCHPs have been providing reliable thermal management to orbiting satellites for many years, including the International Space Station and powerful NASA Weather...
Posted on May 14, 2018
It is well known that the largest thermal gradient in military chassis is located between the card and the frame. For reference, in the typical military chassis, seen below, there are 3 primary thermal resistances:
Posted on May 09, 2018
Been poking around Advanced Cooling Technologies website, looking at the cool stuff (pun intended), but not sure what the next step is?
Posted on March 29, 2018
Today’s design engineers often wear many hats, acting as much a project manager as they do a design engineer.
Posted on March 21, 2018
Posted on February 19, 2018
Not too long ago, CPU’s functioned without advanced heat pipe heat sinks and liquid cooling. At the start of the computer revolution, it was not uncommon for CPU’s to use no heat sinks, followed by simple natural convection heat sinks for thermal enhancement.
Posted on February 06, 2018
The legend of Icarus’ daring escape from his imprisonment in Crete and his subsequent drowning in the Icarian Sea has inspired countless debates on what went wrong on that tragic day more than two thousand years ago.
Posted on January 23, 2018
As we roll towards the end of January, many of us are struggling to keep our new year’s resolution to lose weight. However, for the design engineer faced with packaging devices with increased power and decreased footprint, heat pipe based thermal solutions offer a great way to reduce heat sink size and weight, without deteriorating performance.