As we roll towards the end of January, many of us are struggling to keep our new year’s resolution to lose weight. However, for the design engineer faced with packaging devices with increased power and decreased footprint, heat pipe based thermal solutions offer a great way to reduce heat sink size and weight, without deteriorating performance.
Posted on January 23, 2018
Posted on January 08, 2018
Recently, a study found that 1 in 5 electronics engineers identify thermal issues as a common cause of project delays. As we welcome 2018 with open arms, ACT's New Year's resolution is to ensure none of our engineer friends start their year off on the wrong foot by running into thermal troubles.