ACT's Blog

Un "Lok"-ing the Thermal Bottle Neck in Military Chassis

Posted on May 14, 2018

It is well known that the largest thermal gradient in military chassis is located between the card and the frame.  For reference, in the typical military chassis, seen below, there are 3 primary thermal resistances:

Save Time with This ACT Contact Cheat Sheet

Posted on May 09, 2018

Been poking around Advanced Cooling Technologies website, looking at the cool stuff (pun intended), but not sure what the next step is?

5 Thermal Management Myths

Posted on March 29, 2018

Today’s design engineers often wear many hats, acting as much a project manager as they do a design engineer. 

Trends in the Satellite Industry: 2018 Satellite Conference Review

Posted on March 21, 2018

LEDs Walking the Same Thermal Tracks Left by CPUs

Posted on February 19, 2018

Not too long ago, CPU’s functioned without advanced heat pipe heat sinks and liquid cooling.  At the start of the computer revolution, it was not uncommon for CPU’s to use no heat sinks, followed by simple natural convection heat sinks for thermal enhancement. 

Flying Too Close to the Sun

Posted on February 06, 2018

The legend of Icarus’ daring escape from his imprisonment in Crete and his subsequent drowning in the Icarian Sea has inspired countless debates on what went wrong on that tragic day more than two thousand years ago.

Lose the (Heat Sink) Weight – Keep the Power!

Posted on January 23, 2018

As we roll towards the end of January, many of us are struggling to keep our new year’s resolution to lose weight. However, for the design engineer faced with packaging devices with increased power and decreased footprint, heat pipe based thermal solutions offer a great way to reduce heat sink size and weight, without deteriorating performance.

Thermal Mis-Management

Posted on January 08, 2018

Recently, a study found that 1 in 5 electronics engineers identify thermal issues as a common cause of project delays.  As we welcome 2018 with open arms, ACT's New Year's resolution is to ensure none of our engineer friends start their year off on the wrong foot by running into thermal troubles.